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| LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET DESCRIPTION KEY FEATURES No Output Filter Required Low EMI Design Low Quiescent Current: 2mA Low Shutdown Current:1A Low And Wide Supply Voltage Range: 1.8-6.0 Volt 2W Output Power Into 4 Load With THD<1% 3W Into 2 With THD<1% THD+N As Low As 0.09% Small Form Factor: 16-pin MLPQ Package: 4mmx4mm -40 to +85C Operating Range Only 1 External Component Needed, No Input AC Coupling Capacitor Required, Under Certain Conditions Built-in Clock Frequency 200KHz Built-in Feedback Loop, Allows High Audio Fidelity 14dB/8dB Gain Selectable 20/300Hz Bandwidth Selectable Shut-down Function Internal Thermal Shut-down High Efficiency: 85% Through Modulation Scheme And Class-D Operation Built-in De-pop Circuit, No Turn ON/OFF "POP" Noise The LX1701 family represents a new generation of a fully integrated audio mono class-D amplifier from Microsemi. This CMOS monolithic class-D amplifier series is optimized for low voltage, low power operation and minimum system cost. The products are ideal for use in battery powered applications where low power consumption is desirable such as cell phones, PDA's, web tablets and other low power systems. The LX1701 family provides very low quiescent current consumption through the use of a proprietary output modulation scheme. This technology enables filter-less operation in many applications. The part features on board, low Rdson, complementary output MOSFET's that reduces the need for external components. The LX1701 is offered in a small footprint, low profile surface mountable 16-pin MLPQ package. WWW .Microsemi .C OM IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com PRODUCT HIGHLIGHT PVDD VDD PVDD GAIN Clock Gain Decoder INP Audio Input OUTP APPLICATIONS/BENEFITS + INN PWM H-Bridge & Driver _ VDD OUTN LPF LPF De-POP PDA's Cell Phones Portable Audio Laptop Computer Speaker Amplifier LCD TV/Desktop Monitor Speaker Amplifier PC Audio Multimedia Amplifier LX1701 VSS PVSS LX1701 LX1701 PACKAGE ORDER INFO TJ (C) -40 to 85 Bare Die LX1701 LQ 16-Pin Plastic MLPQ LX1701CLQ Note: Available in Tape & Reel. Append the letters "TR" to the part number. (i.e. LX1701CLQTR) Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 1 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT WWW .Microsemi .C OM Positive Supply Voltage (VDD, PVDD)............................................. -0.3 to 7.0V Operating Temperature ..................................................................-40C to +85C Maximum Operating Junction Temperature ................................................ 150C Storage Temperature......................................................................-65C to 150C Lead Temperature (Soldering, 10 seconds) ................................................ 300C Package Peak Temp for Solder Reflow(40 second maximum exposure)...... 250C (+5, -0) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. TOVL 12 GAIN VINN 10 VINP 11 9 8 7 6 5 VDD 3LEL VSS PVSS 13 14 15 16 1 2 3 4 BW_SEL EN VSS PVSS OUTN PVDD PVDD OUTP THERMAL DATA LQ PACKAGE (Top View) LQ Plastic Micro Lead Quad Package 16-Pin 3.22C/W 38.1C/W THERMAL RESISTANCE-JUNCTION TO CASE, JC THERMAL RESISTANCE-JUNCTION TO AMBIENT, JA Pb-free 100% Matte Tin Finish Junction Temperature Calculation: TJ = TA + (PD x JA). The JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. Thermal Test Board: JESD5-7 (Leaded Surface Mount Package) FUNCTIONAL PIN DESCRIPTION Name OUTN PVDD PVDD OUTP PVSS VSS EN BW_SEL Negative Audio (PWM) Output Positive Supply to Negative Output Stage Positive Supply to Positive Output Stage Positive Audio (PWM) Output Negative Supply to Positive Output Stage (ground) Negative Supply to Analog Stage (ground) Enable Pin, Active High. Bandwidth Selection Pin: VDD 300Hz HP filter VSS No HP (< 20Hz) Gain Selection Pin: Tied to VDD Gain = 14dB Tied to VSS Gain = 8dB Description GAIN VINN VINP TOVL VDD 3LVL VSS PVSS PACKAGE DATA PACKAGE DATA Negative Audio Input Positive Audio Input Thermal Overload Indicator Output, Active HIGH. Analog Positive Power Supply Three Level Modulation Selection Pin: Tied to VSS 2 LEVEL PWM Modulation Scheme, +PVDD | -PVDD; Tied to VDD 3 LEVEL PWM Modulation Scheme, +PVDD | PVSS | -PVDD; Negative Power Supply to Analog Stage Negative Supply to Negative Output Stage (ground) Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 2 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET SYSTEM CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature TA = 25C except where otherwise noted and the following test conditions: Default settings: 20Hz corner low frequency, 14dB gain. Parameter Symbol Test Conditions No Load, VDD = PVDD = 1.8V Supply Current, Quiescent IQQ No Load, VDD = PVDD = 3.3V No Load, VDD = PVDD = 5.0V Supply Current, Shutdown Mode IQQSD Disable pin active VDD = PVDD = 5V, Fin = 1kHz Output Power @ 8 Ohms PO VDD = PVDD = 3.3V, Fin = 1kHz VDD = PVDD = 5V, Fin = 1kHz Output Power @ 4 Ohms PO VDD = PVDD = 3.3V, Fin = 1kHz VDD = PVDD = 5V, Fin = 1kHz Output Power @ 2 Ohms PO VDD = PVDD = 3.3V, Fin = 1kHz Power Efficiency Total Harmonic Distortion @ 50% of Max Power Signal-to-Noise Ratio THD+N SNR THD+N = 1% THD+N = 10% THD+N = 1% THD+N = 10% THD+N = 1% THD+N = 10% THD+N = 1% THD+N = 10% THD+N = 1% THD+N = 10% THD+N = 1% THD+N = 10% 1.3 1.8 0.5 0.7 2.1 2.8 0.9 1.2 3.0 3.9 1.3 1.8 85 0.09 99 % % dB W W W WWW .Microsemi .C OM Min LX1701 Typ 0.9 1.3 2.0 Max 1.2 1.8 2.5 1 Units mA A VDD = PVDD = 5V, Fin = 1kHz, RL = 8 VDD = PVDD = 5V, Fin = 1kHz, RL = 8 VDD = PVDD = 5V, F = 1KHz, PO = 1W, A-Weighted Output Noise Floor Frequency Response Lower Corner Frequency Frequency Response Power Supply Rejection Ratio Common Mode Rejection Ratio Gain VN FLO FHI Input Grounded A-weighted 20-20kHz 3dB relative to 1kHz, BW Select = VSS 3dB relative to 1kHz, BW Select = VDD VDD = PVDD = 1.8 to 5.5V, RL = 4 , PO = 200mW @ 20~80KHz, filterless 25 20 300 3 65 70 14 8 VRMS Hz Hz dB dB dB dB PSRR CMRR GSYS VDD = PVDD = 1.8V to 5.5V VDD = PVDD = 1.8V to 5.5V Pin 9 tied to VDD, VDD = PVDD = 1.8V to 5.5V Pin 9 tied to VSS, VDD = PVDD = 1.8V to 5.5V ELECTRICALS ELECTRICALS Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 3 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET ELECTRICAL CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature -40C TA otherwise noted. Parameter Supply Voltage Oscillator Frequency 85C except where WWW .Microsemi .C OM Symbol VDD PVDD fSW Test Conditions Min 1.8 LX1701 Typ Max 6.0 Units V KHz VDD = PVDD = 1.8~5.5V VDD = PVDD = 5V 180 200 2.0 1.3 0.9 225 2.5 1.8 1.2 1 Supply Current, Quiescent IQQ No Load VDD = PVDD = 3.3V VDD = PVDD = 1.8V mA Supply Current, Shutdown Mode Power Supply Rejection Ratio Common Mode Rejection Ratio Input Impedance Input voltage Range IQQSD PSRR CMRR Disable Pin active VDD = PVDD = 1.8V to 5.5V VDD = PVDD = 1.8V to 5.5V 65 70 A dB dB VIN KIN VDD = PVDD = 1.8~5.5V Gain = 14dB, BW = 20Hz Gain = 14dB, BW = 300Hz Gain = 8dB, BW = 20Hz Gain = 8dB, DB = 300Hz Input shorted to GND, 20Hz corner, 14dB gain VDD = PVDD = 3.3V Gain = 14dB BW = 20Hz, PVDD = 5V Gain = 14dB, BW = 300Hz, PVDD = 5V Gain = 8dB, BW = 20Hz, PVDD = 5V Gain = 8dB, BW = 300Hz, PVDD = 5V VDD = PVDD=5V P Channel N Channel P Channel N Channel P Channel N Channel -0.3 65 72 98 102 2 0.14 1.50 0.25 2.70 360 350 490 460 600 600 14 8 150 VDD +0.3 V Input Resistance Differential K Output DC Offset VOFF VINOFF 8 mV Input DC Offset Dynamic Range Max. with Output VOFF < 200mV V Static Drain-to-source ONResistance RDSON VDD = PVDD=3.3V m VDD = PVDD=1.8V GH GL TJ VTOVL VUV VDD = PVDD =3.3V VDD = PVDD = 1.8~5.5V Stage Gain Thermal Indicator Junction Thermal Indicator Output Under Voltage Threshold Level Enable Threshold Pin 9 tied to VDD, VDD = PVDD = 1.8V to 5.5V Pin 9 tied to VSS, VDD = PVDD = 1.8V to 5.5V dB ELECTRICALS ELECTRICALS C VDD +0.3 1.75 1.7 V V V VDD 1.55 1.3 1.65 1.5 At +85C ambient temperature. Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 4 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET SIMPLIFIED BLOCK DIAGRAM WWW .Microsemi .C OM Triangle Wave Generator EN GAIN Gain Decoder Driver OUTP VINP VINN Dynamic pulse generator Driver LPF LPF OUTN VDD VSS De-pop ground signal ground generation PVSS PVSS PVDD PVDD Figure 1 - LX1701 Simplified Block Diagram BLOCK DIAGRAM BLOCK DIAGRAM Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 5 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET TYPICAL APPLICATION SCHEMATIC WWW .Microsemi .C OM VBAT JP3 JP4 VBAT JP1 8 7 6 5 BW_SEL EN VSS PVSS 9 J1 1 C2 GAIN VINN VINP TOVL OUTP PVDD PVDD OUTN PVSS 3LEL 4 3 2 1 10 11 Audio In 2 LX1701 VBAT J2 1 C3 12 VDD 2 13 14 15 VSS Thermal Indicator 16 VBAT J3 1 2 + VBAT GND VBAT C1 Figure 2 - LX1701 Typical Application Circuit A APPLICATIONS Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 6 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET FUNCTIONAL DESCRIPTION WWW .Microsemi .C OM GENERAL DESCRIPTION The LX1701 is a filterless, low-EMI, class-D audio power amplifier. It offers high performance (THD+N is just 0.1% at 2W), high efficiency (>85% at 1.2W), and best in class EMI radiation (just 20dBuV/m). The internal signal path is completely differential to minimize commonmode noise pickup. The inputs may be driven single-ended or differentially and they may be direct or AC coupled. The LX1701 may be operated with just a single decoupling capacitor. FILTERLESS 3-LEVEL CLASS-D MODULATION The LX1701 output stage is configured as a full H-bridge push-pull driver. The speaker must be driven differentially from the OUTP and OUTN pins. Each side of the speaker is driven by a 200KHz switching signal that transitions between Vdd and GND. With zero input voltage, the duty cycle at each output is around 50% and the signals are inphase with each other. In this case, there is basically no differential voltage across the speaker. When the input signal goes positive, the duty cycle at OUTP increases above 50% and the duty cycle at OUTN decreases below 50%. This causes a net positive current to flow into the speaker. A negative input voltage causes the OUTN duty cycle to increase and the OUTP duty cycle to decrease which causes a net negative current to flow into the speaker. The differential voltage across the speaker has a fundamental frequency of twice the 200KHz switching frequency. The speaker itself serves as the low pass filter which then recreates the audio signal. This type of modulation can be described as driving +Vdd, -Vdd, and 0V across the speaker which is why it is referred to as 3Level modulation. Classical, 2-Level modulation drives either +Vdd or -Vdd across the speaker at all times. This scheme requires an LC filter between the amplifier's outputs and the speaker in order to keep the output current low. LOW-EMI OUTPUT STAGE WITH SLEW RATE LIMITING AND ACTIVE OVERSHOOT CLAMPING With 3-Level modulation, the carrier frequency drives a full amplitude common-mode signal to the speaker wires. This can cause high EMI radiation. One way to combat this would be to filter the outputs with L-C filters or ferrite beads located close to the amplifier. In the LX1701, the output stage has been carefully designed to minimize EMI radiation so that these types of filters are not required. Slew rate limiting is used to keep the outputs from switching too quickly. Active overshoot clamping is used to minimize the inductive overshoot which occurs at each transition. These two techniques allow the LX1701 to easily meet FCC standards for radiated emissions when driving up to 3 meters of speaker wire. ACTIVE DC INPUT OFFSET CANCELLATION An internal DC servo loop senses the output differential voltage and feeds it back to the error amplifier through a low pass filter. The corner frequency of this filter can be set at 20Hz or 300Hz via a control pin. This allows the LX1701 to reject signals below these frequencies. Since this is an active control loop, it does not have the same dynamic range as a purely passive solution (such as an input AC-coupling capacitor). The dynamic range of the offset cancellation loop is a function of the selected gain and high pass corner frequency. In applications where the input offset may be higher than the DC offset cancellation range, AC-coupling capacitors should be used. DIFFERENTIAL SIGNAL PATH, WIDE DYNAMIC RANGE, AND BUILT-IN THERMAL OVERLOAD PROTECTION The fully differential signal path uses delta-sigma techniques and multiple feedback loops to provide high performance and low distortion. This is all fully-integrated to eliminate the need for any external feedback components or filters. The gain can be selected to be either 8 or 14dB by a control pin. The differential signal path and internal voltage boosters allow for wide dynamic range. In fact, the LX1701 can be operated from supplies as low as 1.8V and as high as 6V. The output power will be limited by the available supply voltage. An internal thermal sensing circuit shuts down the outputs and forces the TOVL output pin high when the junction temperature exceeds about 150degC to provide thermal overload protection. DESCRIPTION DESCRIPTION Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 7 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET EVALUATION MODULE TEST SET-UP WWW .Microsemi .C OM Power Supply + - VBAT GND Audio Precision System One IN Output Output + IN + C1 2nd Order RC LPF Audio Precision System One TP+ INPUT + OUT+ OUT TP GND INPUT - C2 On-Board Resistor Load LX1701 C3 LX1701 Eval Kit 2nd Order RC LPF Figure 3 - Typical Test Setup Circuit Default Settings: Equipments: Audio Precision SYSTEM 1, Oscilloscope, Power Supply ~+5V; Supply Voltage: 1.8V/3.3V/5.0V 3 corner voltages On-Board passive LPF: 40KHz cut off frequency (-3dB) On-Board resistor load: 2/4/8 , 5W AP settings: 10Hz ~ 22KHz BPF E EVALUATION Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 8 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET APPLICATION INFORMATION WWW .Microsemi .C OM VBAT R2 470 R3 470 TP1 C3 2200pF JP3 JP2 C2 4700pF VBAT JP1 8 7 6 5 For Test Purpose JP4 BW_SEL EN VSS PVSS Option OUTP PVDD PVDD OUTN 4 3 2 1 9 J1 1 C8 GAIN VINN VINP TOVL 10 11 Audio In 2 LX1701 PVSS VBAT R1 4/2W C6 470nF C7 470nF JP5 J2 1 C9 12 J4 3LEL 14 VDD 2 13 15 VSS Thermal Indicator 16 VBAT VBAT GND J3 1 2 + R4 470 R5 470 TP2 C5 2200pF VBAT C1 C4 4700pF For Test Purpose *C1 Value is dependant on the current drain from power supply, 1.0 ~ 33F with output power 350mW ~ 3.5W Figure 4 - LXE1701 Evaluation Module Schematic A APPLICATIONS Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 9 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET THD+N vs. Power 100 THD+N vs. Power 100 50 WWW .Microsemi .C OM 10 8 OHM,f=1KHz, 10~22KHz BPF 14dB, BW - 20Hz VDD=3.3V 10 8 OHM,f=1KHz, 10~22KHz BPF 14dB, BW - 300Hz VDD=3.3V 1 VDD=1.8V % 0.1 1 VDD=1.8V % 0.1 VDD=5.0V 0.01 VDD=5.0V 0.01 0.001 10m 20m 50m 100m 200m 500m 1 2 W 0.001 10m 20m 50m 100m 200m 500m 1 2 W THD+N vs. Power 100 50 THD+N vs. Power 100 50 T 10 8OHM,f=1KHz, 10~22KHz BPF 8dB, BW - 20Hz 10 8 OHM,f=1KHz, 10~22KHz BPF 8dB, BW - 300Hz 1 VDD=1.8V VDD=3.3V % 1 VDD=1.8V VDD=3.3V % 0.1 0.1 VDD=5.0V VDD=5.0V 0.01 0.01 0.001 10m 20m 50m 100m 200m 500m 1 2 0.001 10m 20m 50m 100m 200m 500m 1 2 W THD+N vs. Power 100 50 THD+N vs. Power 100 50 10 4 OHM,f=1KHz, 10~22KHz BPF 14dB, BW - 20Hz VDD=3.3V 10 4 OHM,f=1KHz, 10~22KHz BPF 14dB, BW - 300Hz VDD=1.8V VDD=3.3V 1 VDD=1.8V % 1 CHARTS CHARTS % 0.1 0.1 VDD=5.0V 0.01 0.01 VDD=5.0V 0.001 10m 20m 50m 100m 200m 500m 1 2 3 0.001 10m 20m 50m 100m 200m 500m 1 2 3 W W Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 10 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET THD+N vs. Power 100 50 THD+N vs. Power 100 50 WWW .Microsemi .C OM 10 4 OHM,f=1KHz, 10~22KHz BPF 8dB, BW - 20Hz VDD=3.3V 10 4 OHM,f=1KHz, 10~22KHz BPF 8dB, BW - 300Hz VDD=1.8V VDD=3.3V 1 VDD=1.8V % 1 % 0.1 0.1 VDD=5.0V 0.01 VDD=5.0V 0.01 0.001 10m 20m 50m 100m 200m 500m 1 2 3 0.001 10m 20m 50m 100m 200m 500m 1 2 3 W W THD+N vs. Power 100 50 100 50 THD+N vs. Power 2 OHM,f=1KHz, 10~22KHz BPF 14dB, BW - 300Hz VDD=1.8V 10 2 OHM,f=1KHz, 10~22KHz BPF 14dB, BW - 20Hz VDD=1.8V VDD=3.3V 10 VDD=3.3V 1 1 % 0.1 % 0.1 VDD=5.0V 0.01 VDD=5.0V 0.01 0.001 10m 0.001 10m 20m 50m 100m 200m 500m 1 2 4 20m 50m 100m 200m 500m 1 2 4 W W THD+N vs. Power 100 50 100 50 THD+N vs. Power T T 10 2OHM,f=1KHz, 10~22KHz BPF 8dB, BW - 20Hz VDD=3.3V VDD=1.8V 10 2 OHM,f=1KHz, 10~22KHz BPF 8dB, BW - 300Hz VDD=1.8V VDD=3.3V 1 1 % C CHARTS % 0.1 0.1 VDD=5.0V VDD=5.0V 0.01 0.01 0.001 10m 0.001 10m 20m 50m 100m 200m 500m 1 2 4 20m 50m 100m 200m 500m 1 2 4 W W Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 11 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET LX1701 2W mono Class-D Audio Amplifier THD+N vs. Frequency 100 LX1701 2W mono Class-D Audio Amplifier THD+N vs. Frequency 100 4OHM,Po=100mW, WWW .Microsemi .C OM 4OHM,Po=50%Pmax, 10~22KHz BPF 10 10 10~22KHz BPF 1 VDD=1.8V 1 VDD=1.8V VDD=5.0V % 0.1 VDD=3.3V VDD=5.0V 0.01 % 0.1 VDD=3.3V 0.01 0.001 100 200 500 1k 2k 5k 10k 20k 0.001 100 200 500 1k 2k 5k 10k 20k Hz Hz LX1701 2W mono Class-D Audio Amplifier THD+N vs. Frequency 100 LX1701 2W mono Class-D Audio Amplifier +5 Frequency Response 8OHM,Po=100mW, 20Hz Corner Frequency +3 8OHM,Po=100mW, 10~22KHz BPF 10 1 VDD=1.8V +1 dBr VDD=1.8V/3.3V/5.0V % 0.1 VDD=5.0V VDD=3.3V 0.01 -1 -3 0.001 100 200 500 1k 2k 5k 10k 20k -5 20 100 500 1k Hz 5k 10k 50k 80k Hz +5 LX1701 2W mono Class-D Audio Amplifier Frequency Response +5 LX1701 2W mono Class-D Audio Amplifier Frequency Response 4OHM,Po=100mW, 20Hz Corner Frequency +3 8OHM,Po=100mW, 300Hz Corner Frequency +3 VDD=1.8V/3.3V/5.0V +1 dBr -1 dBr +1 VDD=1.8V/3.3V/5.0V CHARTS CHARTS -1 -3 -3 -5 20 50 100 500 1k Hz 5k 10k 50k 80k -5 20 50 100 500 1k Hz 5k 10k 50k 80k Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 12 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET LX1701 2W mono Class-D Audio Amplifier Frequency Response +5 4OHM,Po=100mW, 300Hz Corner Frequency +3 VDD=1.8V/3.3V/5.0V +12 +10 LX1701 2W mono Class-D Audio Amplifier System Gain 4OHM,Po=100mW, 8dB GAIN Setting VDD=1.8V/3.3V/5.0V 20Hz Corner Freq. WWW .Microsemi .C OM +8 dBr +1 dBr -1 +6 +4 VDD=1.8V/3.3V/5.0V 300Hz Corner Freq. -3 +2 0 -520 50 100 500 1k Hz 5k 10k 50k 80k 20 50 100 200 500 Hz 1k 2k 5k 10k 20k +12 +10 +8 dBr LX1701 2W mono Class-D Audio Amplifier System Gain 8OHM,Po=100mW, 8dB GAIN Setting VDD=1.8V/3.3V/5.0V 20Hz Corner Freq. +12 +10 +8 dBr LX1701 2W mono Class-D Audio Amplifier System Gain 8OHM,Po=100mW, 8dB GAIN Setting VDD=1.8V/3.3V/5.0V 20Hz Corner Freq. +6 +4 +2 0 VDD=1.8V/3.3V/5.0V 300Hz Corner Freq. +6 +4 +2 0 VDD=1.8V/3.3V/5.0V 300Hz Corner Freq. 20 50 100 500 Hz 1k 5k 10k 20k 20 50 100 500 Hz 1k 5k 10k 20k +20 +18 +16 +14 +12 LX1701 2W mono Class-D Audio Amplifier System Gain VDD=1.8V/3.3V/5.0V 20Hz Corner Freq. 4OHM,Po=100mW, 14dB GAIN Setting +20 +18 +16 +14 dBr +12 +10 +8 +6 +4 +2 0 LX1701 2W mono Class-D Audio Amplifier System Gain 8OHM,Po=100mW, 14dB GAIN Setting VDD=1.8V/3.3V/5.0V 20Hz Corner Freq. dBr +10 +8 +6 +4 +2 0 20 50 100 200 VDD=1.8V/3.3V/5.0V 300Hz Corner Freq. VDD=1.8V/3.3V/5.0V 300Hz Corner Freq. C CHARTS 500 Hz 1k 2k 5k 10k 20k 20 50 100 500 1k Hz 5k 10k 20k Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 13 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET LX1701 2W mono Class-D Audio Amplifier SIgnal-to-Noise Ratio +0 -20 4OHM,10~22KHz BPF LX1701 2W mono Class-D Audio Amplifier SIgnal-to-Noise Ratio +0 -20 -40 -60 -80 -100 -120 -140 WWW .Microsemi .C OM 1.8V / 3.3V / 5.0V 8OHM,10~22KHz BPF 1.8V / 3.3V / 5.0V -40 -60 -80 -100 dBr -120 -140 -160 -180 20 dBr 50 100 200 500 Hz 1k 2k 5k 10k 20k 20 50 100 200 500 Hz 1k 2k 5k 10k 20k LXE1701 3 Feet Speaker Wire. Test DIstance: 3 Meters; Horizential Date: 1/16/2004 Time: 1:08:40PM CKC Laboratories 50 50 LXE1701 3 Feet Speaker Wire. Test DIstance: 3 Meters; Vertical Date: 1/16/2004 Time: 1:22:07PM CKC Laboratories 40 40 30 dB V/m 20 dB V/m 30 20 10 10 0 -10 30 100 1000 -10 30 1 - CISPR 22 B Radiated 100 1000 Frequency (MHz) 1 - CISPR 22 B Radiated Frequency (MHz) C CHARTS Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 14 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET LX1701 Power Supply Rejection Ratio -40 -45 -50 -55 --60 63.25 -65 5 PVDD=VDD=4.0V +/-1V, 8OHM Load WWW .Microsemi .C OM Power Efficiency (8 Ohm) 100% 90% 80% Efficiency (%) 70% 60% 50% 40% 30% 20% 10% 3.0V 4.5V 5.5V dBr -70 -75 -80 -85 -90 -95 -100 10 20 50 100 200 500 1k 2k 5k 10k 20k 80k 0% 0 200 400 600 800 1000 1200 1400 POUT (mW) Hz IQQ Vs. Supply Voltage 1.8 1.6 IQQ (mA) 1.4 1.2 1.0 0.8 8ohm spk 0.6 1.5 2.0 2.5 3.0 3.5 4.0 Voltage (V) 4.5 5.0 5.5 6.0 CHARTS CHARTS Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 15 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET PCB DESIGN GUIDELINES WWW .Microsemi .C OM PCB DESIGN GUIDELINES One of the key efforts in implementing the MLP package on a pc board is the design of the land pattern. The MLP has rectangular metallized terminals exposed on the bottom surface of the package body. Electrical and mechanical connection between the component and the pc board is made by screen printing solder paste on the pc board and reflowing the paste after placement. To guarantee reliable solder joints it is essential to design the land pattern to the MLP terminal pattern, exposed PAD and Thermal PAD via. There are two basic designs for PCB land pads for the MLP: Copper Defined style (also known as Non Solder Mask Defined (NSMD)) and the Solder Mask Defined style (SMD). The industry has had some debate of the merits of both styles of land pads, and although we recommend the Copper Defined style land pad (NSMD), both styles are acceptable for use with the MLP package. NSMD pads are recommended over SMD pads due to the tighter tolerance on copper etching than solder masking. NSDM by definition also provides a larger copper pad area and allows the solder to anchor to the edges of the copper pads thus providing improved solder joint reliability. DESIGN OF PCB LAND PATTERN FOR PACKAGE TERMINALS As a general rule, the PCB lead finger pad (Y) should be designed 0.2-0.5mm longer than the package terminal length for good filleting. The pad length should extended 0.05mm towards the centerline of the package. The pad width (X) should be a minimum 0.05mm wider than the package terminal width (0.025mm per side), refer to figure 5. However, the pad width is reduced to the width of the component terminal for lead pitches below 0.65mm. This is done to minimize the risk of solder bridging. EXPOSED PAD PCB DESIGN The construction of the Exposed Pad MLP enables enhanced thermal and electrical characteristics. In order to take full advantage of this feature the exposed pad must be physically connected to the PCB substrate with solder. The thermal pad (D2th) should be greater than D2 of the MLP whenever possible, however adequate clearance (Cpl > 0.15mm) must be met to prevent solder bridging. If this clearance cannot be met, then D2th should be reduced in area. The formula would be: D2TH >D2 only if D2TH < Gmin - (2 x Cpl). Zmin 4.55mm D2th 2.5mm Max Gmin 2.9mm Figure 6 - Land Pattern for LQ16 (4x4mm) Zmin= D + aaa + 2(0.2) (where pkg body tolerance aaa=0.15) (where 0.2 is outer pad extension) Gmin= D-2(Lmax)-2(0.05) (where 0.05 is inner pad extension) (Lmax=0.50 for this example) D2th max = Gmin-2(CpL) (where CpL=0.2) Part Part Lead APPLICATIONS APPLICATIONS 0.05mm Y2 Solder PCB Pad PCB 0.20mm Y1 (X1) Min: 0.025mm Per side for lead pitches > 0.65mm Figure 5 - PC Board Land Pattern Geometry for MLP Terminals Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 16 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET PCB DESIGN GUIDELINES (CONTINUED) THERMAL PAD VIA DESIGN There are two types of on-board thermal PAD design, one is using thermal vias to sink the heat to the other layer with metal traces. Based on Jedec Specification JESD 51-5, the thermal vias should be designed like Figure 7. Another one is the no via thermal PAD which is using the same side copper PAD as heatsink, this type of thermal PAD is good for two layer board, since the bottom side is filled with all other kinds of trace also, it's hard to use the whole plane for the heatsink. But you still can use vias to sink the heat to the bottom layer by the metal traces, then layout a NMSD on which a metal heatsink is put to sink the heat to the air. For LX1701 with MLPQ-4x4 16Lds p ackage, which has jA =38.1C/W by package itself, with maximum 2W (@4ohm) output it only has 300mW power dispassion (assuming 85% efficiency), which only has 11.4C temperature rise. So the non-via type thermal PAD is suggested. 1 - 1.2mm 0.05mm minimum 0.5mm WWW .Microsemi .C OM 0.15mm minimum gap 2.50mm Maximum 0.15mm minimum 0.37mm Nominal Package Pad PCB Land Thermal Via 0.3mm Dia. 0.28mm Pin 1 Indicator (bottom of Package) Top View Figure 8 - Recommended Land Pad with Vias for LQ16 Micro Lead Quad Package Land Pattern Land Pattern for Four Layer Board with Vias Figure 7 - Comparison of land pattern theory APPLICATIONS APPLICATIONS Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 17 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET APPLICATION INFORMATION WWW .Microsemi .C OM Figure 9 - LXE1701 Evaluation Module PCB Layout 6mm APPLICATIONS APPLICATIONS Figure 10 - LX1701 real PCB area with decoupling capacitor Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 4mm Page 18 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET PACKAGE DIMENSIONS WWW .Microsemi .C OM LQ 16-Pin MLPQ Plastic (4x4mm EP / 114x114Cu Exposed Pad) D b E2 L E D2 e A1 A3 Dim A A1 A3 b D E e D2 E2 K L MILLIMETERS MIN MAX 0.80 1.00 0 0.05 0.2 REF 0.23 0.38 4.00 BSC 4.00 BSC 0.65 BSC 2.55 2.80 2.55 2.80 0.20 0.30 0.50 INCHES MIN MAX 0.031 0.039 0 0.002 0.008 REF 0.009 0.015 0.157 BSC 0.157 BSC 0.026 BSC 0.100 0.110 0.100 0.110 0.008 0.012 0.020 Note: 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006") on any side. Lead dimension shall not include solder coverage. A K M MECHANICALS Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 19 LX1701 TM (R) 2W Filterless Mono Class-D Audio Amplifier PRODUCTION DATA SHEET NOTES WWW .Microsemi .C OM NOTES NOTES PRODUCTION DATA - Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright (c) 2004 Rev. 1.0a, 2004-07-09 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove CA. 92841 714-898-8121, FAX 714-893-2570 Page 20 |
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